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Flash память фирмы Samsung Semiconductor
Samsung Semiconductor Flash Memory |
Old Part Number |
New Part Number |
Organization |
Operating Voltage, V |
Temperature |
Package |
Production Status |
Comments |
NAND |
KM29W040AT | K9F4008W0A |
512K x 8 | 3.0~5.5 | C, I | 44 TSOP2 | Mass Production |
|
KM29W8000T | K9F8008W0M |
1M x 8 | 2.7~5.5 | C, I | 44 TSOP2 | Mass Production |
|
KM29W16000AT | K9F1608W0A |
2M x 8 | 2.7~5.5 | C , I | 44 TSOP2 | Mass Production |
|
KM29W16000BT | K9F1608W0B |
2.7~5.5 | C, I | 44 TSOP2 | Under Development |
|
KM29W32000AT | K9F3208W0A |
4M x 8 | 2.7~5.5 | C , I | 44 TSOP2 | Mass Production |
|
KM29U64000AT | K9F6408U0A |
8M x 8 | 2.7~3.6 | C , I | 44 TSOP2 | Under Development |
|
KM29U64000T | K9F6408U0M |
2.7~3.6 | C , I | 44 TSOP2 | Mass Production |
|
KM29U128AT | K9F2808U0A |
16M x 8 | 2.7~3.6 | C , I | 48 TSOP1 | Under Development |
|
KM29U128T | K9F2808U0M |
2.7~3.6 | C , I | 48 TSOP1 | Mass Production |
|
KM29U256T | K9F5608U0M |
32M x 8 | 2.7~3.6 | C , I | 48 TSOP1 | Under Development |
|
SmartMedia |
SMFV002 | K9S1608V0A |
2M x 8 | 3.0~3.6 | 0~55°C | 22 PAD | Mass Production |
|
SMFV002A | K9S1608V0B |
3.0~3.6 | 0~55°C | 22 PAD | Under Development |
|
SMFV004A | K9S3208V0A |
4M x 8 | 3.0~3.6 | 0~55°C | 22 PAD | Under Development |
|
SMFV004 | - |
3.0~3.6 | 0~55°C | 22 PAD | Mass Production |
|
SMFV008A | K9S6408V0A |
8M x 8 | 2.7~3.6 | 0~55°C | 22 PAD | Under Development |
|
SMFV008 | K9S6408V0M |
2.7~3.6 | 0~55°C | 22 PAD | Mass Production |
|
SMFV016A | K9S2808V0A |
16M x 8 | 2.7~3.6 | 0~55°C | 22 PAD | Under Development |
|
SMFV016 | K9S2808V0M |
2.7~3.6 | 0~55°C |
22 PAD | Mass Production |
|
SMFDV032 | K9D5608V0M |
32M x 8 | 2.7~3.6 | 0~55°C | 22 PAD | Mass Production | Dual Chip |
SMFV032 | K9S5608V0M |
2.7~3.6 | 0~55°C | 22 PAD | Under Development |
|
SMFDV064 | K9D1208V0M |
64M x 8 | 2.7~3.6 | 0~55°C | 22 PAD | Under Development | Dual Chip |
Новая система обозначений Flash памяти фирмы Samsung Semiconductor
K | 9 |
X | XX |
XX | X |
X | X |
- | X |
X | X |
X | X |
1 | 2 | 3 | 4 | 5 | 6 |
7 | 8 |
| 9 | 10 |
11 | 12 | 13 |
1. Memory(K) | 2. NAND Flash : 9 |
3. Small Classification (SLC : Single Level Cell, MLC : Multi Level Cell, SM : SmartMedia)
- F: SLC Normal
- K: SLC Die Stack
- S: SLC Single SM
- T: MLC Single SM
|
- D: SLC Dual SM
- G: MLC Normal
- L: MLC Die Stack
- E: MLC Dual SM
|
|
4. Density
|
5. Organization
|
6. VCC
- C: 5.0V(4.5V~5.5V)
- V: 3.3V(3.0V~3.6V)
|
- U: 2.7V~3.6V
- W: 2.7V~5.5V,3.0V~5.5V
|
|
7. Reserved |
8. Version Suffix
- M: 1st Generation
- A: 2nd Generation
- B: 3rd Generation
|
- C: 4th Generation
- D: 5th Generation
- E: 6th Generation
|
|
9. "-" |
10. Package
- C: CHIP BIZ
- J: SOJ
- T: TSOP2
- W: WAFER
|
- G: SOP
- S: SmartMedia
- R: TSOP2(R)
- Y: TSOP1
|
|
11. Temperature
- C: Commerial
- I: Industrial
|
|
|
12. Bad Block
- S: All Good Block
- L: 1~5 Bad Block
|
- B: Include Bad Block
- 0: NONE(Water, CHIP BIZ)
|
|
13. Reserved |
|